Characterization of grain boundaries in multicrystalline silicon with high lateral resolution using conductive atomic force microscopy

Rumler M, Rommel M, Erlekampf J, Azizi M, Geiger T, Bauer AJ, Meissner E, Frey L (2012)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2012

Journal

Journal of Applied Physics AIP Publishing

Publisher: American Institute of Physics Inc.

Book Volume: 112

Article Number: 034909

Journal Issue: 3

DOI: 10.1063/1.4746742

Authors with CRIS profile

Jürgen Erlekampf Lehrstuhl für Elektronische Bauelemente Lothar Frey Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Rumler, M., Rommel, M., Erlekampf, J., Azizi, M., Geiger, T., Bauer, A.J.,... Frey, L. (2012). Characterization of grain boundaries in multicrystalline silicon with high lateral resolution using conductive atomic force microscopy. Journal of Applied Physics, 112(3). https://doi.org/10.1063/1.4746742

MLA:

Rumler, Maximilian, et al. "Characterization of grain boundaries in multicrystalline silicon with high lateral resolution using conductive atomic force microscopy." Journal of Applied Physics 112.3 (2012).

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