Crack healing induced electrical and mechanical properties recovery in a Ti2SnC ceramic

Li S, Bei G, Chen X, Zhang L, Zhou Y, Mackovic M, Spiecker E, Greil P (2016)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2016

Journal

Journal of the European Ceramic Society Elsevier

Publisher: Elsevier

Book Volume: 36

Pages Range: 25-32

Journal Issue: 1

DOI: 10.1016/j.jeurceramsoc.2015.09.019

Abstract

Ceramics are able to heal cracks and flaws by triggering local sintering (internal cracks) or oxidation reaction (surface cracks) which may induce the recovery of mechanical strength. Crack healing in ceramics, however, is limited to micro-sized cracks and requires elevated temperatures (above 1000°C) and long time periods even up to 100h. In this work we report on accelerated crack healing of a TiSnC ceramic which is capable to repair thermal shock induced cracks at a relatively low temperature of 800°C within only 1h. After healing treatment both the low flexural strength and electrical conductivity measured on the damaged material after quenching were almost fully recovered. Furthermore, TiSnC exhibits repeatable healing capability which offers a high potential for developing durable ceramics with prolonged lifetime under harsh thermal conditions.

Authors with CRIS profile

Guoping Bei Lehrstuhl für Glas und Keramik Mirza Mackovic Lehrstuhl für Werkstoffwissenschaften (Mikro- und Nanostrukturforschung) Erdmann Spiecker Lehrstuhl für Werkstoffwissenschaften (Mikro- und Nanostrukturforschung) Peter Greil Lehrstuhl für Glas und Keramik

Additional Organisation(s)

Graduiertenkolleg 1896/2 In situ Mikroskopie mit Elektronen, Röntgenstrahlen und Rastersonden Exzellenz-Cluster Engineering of Advanced Materials Interdisziplinäres Zentrum, Center for Nanoanalysis and Electron Microscopy (CENEM)

Involved external institutions

Beijing Jiaotong University / 北京交通大学 CN China (CN)

How to cite

APA:

Li, S., Bei, G., Chen, X., Zhang, L., Zhou, Y., Mackovic, M.,... Greil, P. (2016). Crack healing induced electrical and mechanical properties recovery in a Ti2SnC ceramic. Journal of the European Ceramic Society, 36(1), 25-32. https://doi.org/10.1016/j.jeurceramsoc.2015.09.019

MLA:

Li, Shibo, et al. "Crack healing induced electrical and mechanical properties recovery in a Ti2SnC ceramic." Journal of the European Ceramic Society 36.1 (2016): 25-32.

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