Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems

Kleffel T, Drummer D (2018)

Publication Type: Journal article, Original article

Publication year: 2018

Journal

Journal of Polymer Engineering Freund Publishing House Ltd

DOI: 10.1515/polyeng-2017-0432

Authors with CRIS profile

Tobias Kleffel Lehrstuhl für Kunststofftechnik (LKT) Dietmar Drummer Lehrstuhl für Kunststofftechnik (LKT)

Related research project(s)

Grundlagenuntersuchung zum Trennen, Umformen und Montagespritzguss und deren Interdependenz für die Herstellung beständig mediendichter elektronischer Systeme June 1, 2012 - Nov. 30, 2018 Fundamental investigation of cutting, forming and assembly injection moulding and their interdependence for manufacturing durable tight electronic systems June 1, 2012 - May 30, 2018

How to cite

APA:

Kleffel, T., & Drummer, D. (2018). Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems. Journal of Polymer Engineering. https://doi.org/10.1515/polyeng-2017-0432

MLA:

Kleffel, Tobias, and Dietmar Drummer. "Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems." Journal of Polymer Engineering (2018).

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