CMOS compatible and ultra broadband on-chip SiC frequency comb (SiComb)

Third Party Funds Group - Sub project

Acronym: SiComb

Start date : 01.10.2020

End date : 30.09.2023

Overview

External partners

(2)

Overall project details

Overall project

CMOS compatible and ultra broadband on-chip SiC frequency comb

Project details

Involved:

Peter Wellmann Project Leader

Contributing FAU Organisations:

Professur für Werkstoffwissenschaften (Werkstoffe der Elektrotechnik)

Funding Source

EU - 8. Rahmenprogramm - Horizon 2020 FET - FETOpen