Internally funded project
Start date : 01.01.2000
The production of the CVD diamond layer can take place separately from the components’ surface. To achieve this, a CVD diamond coating is deposited on silicon or copper based substrates. Free-standing diamond foils with a layer thickness of 20 µm and above can be peeled off the substrate. Laser cutting allows the adequate tailoring of the diamond foils. Bonding and soldering processes are currently under research and are developed for „cold” application onto the component surface.
Application examples:
The production of the CVD diamond layer can take place separately from the components’ surface. To achieve this, a CVD diamond coating is deposited on silicon or copper based substrates. Free-standing diamond foils with a layer thickness of 20 µm and above can be peeled off the substrate. Laser cutting allows the adequate tailoring of the diamond foils. Bonding and soldering processes are currently under research and are developed for „cold” application onto the component surface.
Application examples: