Tim Pfahler

Lehrstuhl für Hochfrequenztechnik

An Ultra-Wideband Microstrip Gain Equalizer on Thin-Film Ceramic for Future Millimeter Wave Applications up to and Beyond 120 GHz (2024) Scheder A, Pfahler T, Bridier A, Vossiek M Conference contribution Compact 150 GHz and 300 GHz Dual-Band On-Chip Antenna for Future Communication and Sensing Applications (2024) Pfahler T, Schür J, Vossiek M Conference contribution Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz (2024) Pfahler T, Breun S, Engel L, Geissler C, Schür J, Vossiek M Journal article A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs (2024) Pfahler T, Scheder A, Bridier A, Nagel M, Vossiek M Journal article A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Journal article A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Conference contribution Single-Fed Additively Manufactured Conical Horn Antenna with Circular Polarization for Millimeter-Wave Applications (2023) Dorbath B, Lomakin K, Pfahler T, Schür J, Vossiek M Conference contribution Compact and Broadband 300 GHz Three-Element on-chip Patch Antenna (2023) Pfahler T, Vossiek M, Schür J Conference contribution Complex Permittivity Extraction of IC-Package Materials beyond 110 GHz by Band-Limited Waveguide-Cavity Measurements (2023) Pfahler T, Gold G, Bachbauer F, Schür J, Vossiek M Conference contribution An Ultra-Wideband DC-Block on Thin-Film Ceramic for the Next Generation of Test and Measurement Applications Up to 150 GHz (2023) Scheder A, Pfahler T, Bridier A, Schür J, Vossiek M Conference contribution