Marcel Sippel

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Improvement in bond wire reliability by adjustments in bond wire microstructure via heat treatment (2026) Seltsam J, Sippel M, Kuglstatter M, Schmidt R, Dreher P, Franke J, Höppel HW Journal article Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication (2024) Utsch D, Sippel M, Voigt C, Häußler F, Franke J Journal article Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Journal article Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography (2023) Käsbauer M, Dreher P, Sippel M, Schmidt R Journal article Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing (2023) Ockel M, Sippel M, Hecht C, Janisch L, Franke J Conference contribution, Conference Contribution Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds (2023) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Conference contribution High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution