Zechun Yu

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Lehrstuhl für Elektronische Bauelemente Lehrstuhl für Leistungselektronik (LEE)
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Automated quantitative analysis of void morphology evolution in Ag[sbnd]Ag direct bonding interface after accelerated aging (2021) Yu Z, Xu T, Letz S, Bayer CF, Schletz A, März M Journal article Cu-Cu Thermocompression Bonding with Cu-Nanowire Films for Power Semiconductor Die-Attach on DBC Substrates (2021) Yu Z, Yu Z, Tan YZ, Bayer CF, Rauh H, Schletz A, März M, Birlem O Conference contribution Reliability of silver direct bonding in thermal cycling tests (2020) Yu Z, Zeng W, Zhao D, Zhang Z, Bayer CF, Schletz A, März M Conference contribution Integration of printed electronics with potted power electronic modules (2020) Zimmermann V, Zörner A, Chen W, Yu Z, Jank M, Bayer C, Schletz A, März M Conference contribution Heterogeneous Integration of Vertical GaN Power Transistor on Si Capacitor for DC-DC Converters (2018) Yu Z, Zeltner S, Boettcher N, Rattmann G, Leib J, Bayer C, Schletz A, et al. Conference contribution, Conference Contribution