Dr.-Ing. Jan Steffen Schür

Lehrstuhl für Hochfrequenztechnik

Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz (2024) Pfahler T, Breun S, Engel L, Geissler C, Schür J, Vossiek M Journal article A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Journal article Passive, Wireless In Situ Millimeterwave Sensor with Mounted Dielectric Channels for Cure Monitoring of Carbon Fiber-Reinforced Polymers (2023) Dorbath B, Schür J, Ziegmann G, Vossiek M Journal article Transmission Loss Analysis of Unidirectional Carbon Fiber-Reinforced Polymers for Millimeter Waves for Linear and Circular Polarization (2023) Dorbath B, Schür J, Vossiek M Journal article A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface (2023) Pfahler T, Scheder A, Bridier A, Schür J, Vossiek M Conference contribution Single-Fed Additively Manufactured Conical Horn Antenna with Circular Polarization for Millimeter-Wave Applications (2023) Dorbath B, Lomakin K, Pfahler T, Schür J, Vossiek M Conference contribution Combining radar and ultrasound imaging for surface echo compensation and augmented visibility of interior structures in NDT applications (2023) Ullmann I, Schür J, Vossiek M Conference contribution, Conference Contribution Compact and Broadband 300 GHz Three-Element on-chip Patch Antenna (2023) Pfahler T, Vossiek M, Schür J Conference contribution Complex Permittivity Extraction of IC-Package Materials beyond 110 GHz by Band-Limited Waveguide-Cavity Measurements (2023) Pfahler T, Gold G, Bachbauer F, Schür J, Vossiek M Conference contribution An Ultra-Wideband DC-Block on Thin-Film Ceramic for the Next Generation of Test and Measurement Applications Up to 150 GHz (2023) Scheder A, Pfahler T, Bridier A, Schür J, Vossiek M Conference contribution