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Mark Sippel
List of publications:
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Lehrstuhl für Hochfrequenztechnik
Project Leads
(1)
Publications
(35)
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Journal article
Journal article
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Book chapter / Article in edited volumes
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Authored book
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Translation
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Thesis
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Conference contribution
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Unpublished / Preprint
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Additively manufactured antennas based on slotted ridged waveguides for 77 GHz MIMO radar applications (2023)
Kleinlein M, Lomakin K, Rösner F, Hofmann A, Sippel M, Gold G
Conference contribution, Conference Contribution
Monolithic Additively Manufactured Conformal 4x4 MIMO Radar Frontend based on Slotted Waveguide Array Antennas for 77 GHz Corner Radar (2023)
Lomakin K, Alhasson S, Hofmann A, Sippel M, Gold G
Conference contribution, Conference Contribution
SLS-Printed E-Band Waveguides and the Impact of Surface Roughness (2023)
Hofmann A, Lomakin K, Kleinlein M, Bader T, Sippel M, Gold G
Conference contribution, Abstract of lecture
Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications (2022)
Hofmann A, Klein L, Lomakin K, Sippel M, Gold G
Conference contribution
Additively Manufactured Slotted Waveguides for THz Applications (2022)
Hofmann A, Lomakin K, Sippel M, Gold G
Conference contribution, Conference Contribution
Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications (2022)
Hofmann A, Lomakin K, Sippel M, Gold G
Conference contribution, Conference Contribution
Additive Manufactured Waveguide for E-Band Using Ceramic Materials (2021)
Hubert F, Bader T, Wahl L, Hofmann A, Lomakin K, Sippel M, Travitzky N, Gold G
Journal article, Original article
Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides (2021)
Tesmer H, Gold G, Bachbauer F, Polat E, Sippel M, Jakoby R, Vossiek M, Maune H
Journal article
3D Printed Slotted Waveguide Array Antenna for D-Band Applications (2021)
Lomakin K, Sippel M, Helmreich K, Gold G
Conference contribution, Conference Contribution
RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics (2021)
Neermann S, Franke J, Sippel M, Lomakin K, Gold G
Conference contribution
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