Felix Häußler

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Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)
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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
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Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution Aerosol-Jet-Printed Encapsulation of Organic Photovoltaics (2023) Basu R, Siah KS, Distler A, Häußler F, Franke J, Brabec C, Egelhaaf HJ Journal article High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints (2022) Häußler F, Sippel M, Sprenger M, Liu L, Muckelbauer M, Franke J Conference contribution Manufacturing of Ceramic Based Mechatronic Integrated Devices Using Laser-Direct-Structuring (2022) Bräuer P, Stoll T, Muckelbauer M, Häußler F, Hensel A, Franke J Conference contribution Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach (2021) Häußler F, Schöttner J, Schubert J, Muckelbauer M, Spiecker E, Franke J Conference contribution, Conference Contribution Solderability of Injection Moldable Thermoset Resins for Use in 3D Mechatronic Integrated Devices (2020) Häußler F, Petillon S, Dornheim J, Weser S, Eberhardt W, Zimmermann A, Franke J Conference contribution Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging (2020) Häußler F, Shen S, Petillon S, Weser S, Haybat M, Eberhardt W, Zimmermann A, Franke J Journal article Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments (2019) Yu Z, Wang S, Letz S, Bayer CF, Häußler F, Schletz A, SUGANUMA K Conference contribution, Conference Contribution
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