Felix Häußler

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication (2024) Utsch D, Sippel M, Voigt C, Häußler F, Franke J Journal article Strain measurement on rolling bearings using sensors applied by aerosol-based deposition (2024) Bartz M, Häußler F, Halmos F, Ankenbrand M, Jüttner M, Franke J, Wartzack S Conference contribution, Conference Contribution Digitally printed strain gauges on 3D metallic objects for pressure sensing (2024) Roudenko J, Häußler F, Franke J, Reichenberger M Conference contribution Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions (2023) Bartz M, Häußler F, Halmos F, Ankenbrand M, Jüttner M, Roudenko J, Wirsching S, et al. Journal article Additive metallization of alumina with copper-titanium powder blends for power electronic applications (2023) Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J Journal article Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics (2023) Utsch D, Häußler F, Voigt C, Sippel M, Franke J Conference contribution, Conference Contribution Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023) Utsch D, Häußler F, Sprenger M, Zirn J, Franke J Conference contribution Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications (2023) Alzoubi K, Hensel A, Häußler F, Ottinger B, Sippel M, Franke J Journal article Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications (2023) Hecht C, Schadow E, Sprenger M, Häußler F, Stoll T, Franke J Conference contribution, Conference Contribution Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components (2023) Voigt C, Petersen M, Thielen N, Utsch D, Häußler F, Kirchberger M, Franke J Conference contribution, Conference Contribution