Franz Xaver Röhrl

Lehrstuhl für Technische Elektronik

Characterization and Production of PCB Structures With Increased Ratio of Electromagnetic Field in Air (2020) Sepaintner F, Scharl A, Röhrl FX, Bogner W, Zorn S Journal article Simulation and Measurement of PCB Crossover Structures from DC up to 70 GHz (2020) Scharl A, Sepaintner F, Röhrl FX, Bogner W, Zorn S Conference contribution Multilayer Topology Optimization of Wideband SIW-to-Waveguide Transitions (2020) Hassan E, Scheiner B, Michler F, Berggren M, Wadbro E, Röhrl FX, Zorn S, et al. Journal article Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air (2019) Sepaintner F, Scharl A, Röhrl FX, Bogner W, Zorn S Conference contribution, Conference Contribution WR12 to planar transmission line transition on organic substrate (2019) Jakob J, Sammer R, Röhrl FX, Zorn S, Bogner W Conference contribution, Conference Contribution Bare die connections via aerosol jet technology for millimeter wave applications (2019) Röhrl FX, Jakob J, Bogner W, Weigel R, Zorn S Journal article Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications (2018) Röhrl FX, Jakob J, Bogner W, Weigel R, Zorn S Conference contribution, Conference Contribution Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications - A method to combine low tolerances and low prices on standard pcb substrates (2017) Röhrl FX, Sammer R, Jakob J, Bogner W, Weigel R, Hassel U, Zorn S Conference contribution, Conference Contribution Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package (2016) Röhrl FX, Bogner W, Jakob J, Hageneder D, Zorn S Conference contribution Wideband RF Interconnects for Organic Chip Packages - Comparison of single ended and differential transitions (2015) Röhrl FX, Bogner W, Jakob J, Hageneder D Conference contribution, Original article