Markus Ankenbrand

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Strain measurement on rolling bearings using sensors applied by aerosol-based deposition (2024) Bartz M, Häußler F, Halmos F, Ankenbrand M, Jüttner M, Franke J, Wartzack S Conference contribution, Conference Contribution Use of printed sensors to measure strain in rolling bearings under isolated boundary conditions (2024) Bartz M, Halmos F, Jüttner M, Ankenbrand M, Häusler F, Franke J, Wartzack S Journal article Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas (2024) Ankenbrand M, Panusch D, Piechulek N, Gold G, Helmreich K, Franke J Conference contribution Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions (2023) Bartz M, Häußler F, Halmos F, Ankenbrand M, Jüttner M, Roudenko J, Wirsching S, et al. Journal article Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring (2023) Ankenbrand M, Panusch D, Utsch D, Banea K, Ehrngruber M, Gold G, Helmreich K, Franke J Conference contribution, Conference Contribution Einsatz von gedruckten Sensoren zur Messung der Dehnung von Wälzlagern unter isolierten Randbedingungen (2023) Halmos F, Jüttner M, Bartz M, Ankenbrand M, Häusler F, Franke J, Wartzack S Journal article, Report Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren (2022) Utsch D, Milich N, Ankenbrand M, Franke J Conference contribution, Conference Contribution 3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy (2019) Sippel M, Lomakin K, Ankenbrand M, Petersen M, Franke J, Helmreich K, Vossiek M, Gold G Conference contribution, Conference Contribution Programming and evaluation of a multi-Axis/multi-process manufacturing system for mechatronic integrated devices (2019) Ankenbrand M, Eiche Y, Franke J Conference contribution Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz (2019) Lomakin K, Ankenbrand M, Sippel M, Franke J, Helmreich K, Gold G Conference contribution