Markus Ankenbrand


Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

Publication year




Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions (2023) Bartz M, Häußler F, Halmos F, Ankenbrand M, Jüttner M, Roudenko J, Wirsching S, et al. Journal article Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring (2023) Ankenbrand M, Panusch D, Utsch D, Banea K, Ehrngruber M, Gold G, Helmreich K, Franke J Conference contribution, Conference Contribution Einsatz von gedruckten Sensoren zur Messung der Dehnung von Wälzlagern unter isolierten Randbedingungen (2023) Halmos F, Jüttner M, Bartz M, Ankenbrand M, Häusler F, Franke J, Wartzack S Journal article, Report Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren (2022) Utsch D, Milich N, Ankenbrand M, Franke J Conference contribution, Conference Contribution 3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy (2019) Sippel M, Lomakin K, Ankenbrand M, Petersen M, Franke J, Helmreich K, Vossiek M, Gold G Conference contribution, Conference Contribution Programming and evaluation of a multi-Axis/multi-process manufacturing system for mechatronic integrated devices (2019) Ankenbrand M, Eiche Y, Franke J Conference contribution Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz (2019) Lomakin K, Ankenbrand M, Sippel M, Franke J, Helmreich K, Gold G Conference contribution Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies (2018) Ankenbrand M, Scheetz M, Franke J, Lomakin K, Sippel M, Gold G, Helmreich K Conference contribution, Conference Contribution Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material (2018) Lomakin K, Pavlenko T, Ankenbrand M, Sippel M, Ringel J, Scheetz M, Klemm T, et al. Journal article, Review article Substituting bond wires by additively manufactured interconnections (2018) Lomakin K, Sippel M, Gold G, Ringel J, Weiß D, Helmreich K, Ankenbrand M, Franke J Conference contribution