Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
Evaluation of Semiconductor-Based Isolation for Electric Vehicle Chargers in DC Microgrids (2024)
Drexler K, Gehring J, Wunder B, Zhou Y, März M, Lorentz VRH
Conference contribution, Original article
Analytical Modelling of the Quasi-Static Operation of a Monolithically Integrated 4H-SiC Circuit Breaker Device (2024)
Boettcher N, Rommel M, Erlbacher T
Journal article
Simulation-Guided Analysis towards Trench Depth Optimization for Enhanced Flexibility in Stretch-Free, Shape-Induced Interconnects for Flexible Electronics (2024)
Joch D, Lang T, Sanctis S, Jank MP
Journal article
AI for Stability Optimization in Low Voltage Direct Current Microgrids (2024)
Roeder G, Schwanninger R, Wienzek P, Kerscher M, Wunder B, Schellenberger M
Book chapter / Article in edited volumes
Operating strategies for a Regional Airport to challenge future hybrid-electric aircraft systems (2024)
Meindl M, Krödel PO, Lange C, März M
Conference contribution, Original article
Velocity-Based Channel Charting with Spatial Distribution Map Matching (2024)
Stahlke M, George Y, Feigl T, Eskofier B, Mutschler C
Journal article
Adhesion strength of ductile thin film determined by cross-sectional nanoindentation (2024)
Zhao D, Letz S, Jank M, März M
Journal article
Increasing 4H-SiC Trench Depth by Improving the Dry Etch Selectivity towards the Oxide Hard Mask (2024)
Rusch O, Brueckner K, Erlbacher T
Book chapter / Article in edited volumes
A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C (2024)
May A, Rommel M, Baier L, Schraml M, Dick J, Jank M, Schulze J
Conference contribution
Imaging effects of particles on the surface of EUV mask and wafer (2024)
Semaan R, Bottiglieri G, Erdmann A, Rispens G, de Winter L, Beekmans S
Conference contribution