Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Research facility
Location:
Erlangen,
Germany (DE)
ISNI: 0000000104810543
ROR: https://ror.org/04q5rka56
Velocity-Based Channel Charting with Spatial Distribution Map Matching (2024)
Stahlke M, George Y, Feigl T, Eskofier B, Mutschler C
Journal article
Adhesion strength of ductile thin film determined by cross-sectional nanoindentation (2024)
Zhao D, Letz S, Jank M, März M
Journal article
Increasing 4H-SiC Trench Depth by Improving the Dry Etch Selectivity towards the Oxide Hard Mask (2024)
Rusch O, Brueckner K, Erlbacher T
Book chapter / Article in edited volumes
A 4H-SiC CMOS Technology enabling Smart Sensor Integration and Circuit Operation above 500 °C (2024)
May A, Rommel M, Baier L, Schraml M, Dick J, Jank MP, Schulze J
Conference contribution
Imaging effects of particles on the surface of EUV mask and wafer (2024)
Semaan R, Bottiglieri G, Erdmann A, Rispens G, de Winter L, Beekmans S
Conference contribution
Epitaxy of >7 μm Thick GaN Drift Layers on 150 mm Si(111) Substrates Realizing Vertical PN Diodes with 1200 V Breakdown Voltage (2024)
Michler S, Hamdaoui Y, Thapa S, Schwalb G, Besendörfer S, Ziouche K, Albrecht M, et al.
Journal article
Hybrid Modulation Scheme for CLLC Resonant Converter with Ultra-Wide Voltage Range for V2G Applications (2024)
Yang X, Wunder B, Yin S, Schwanninger R, März M, Lorentz V
Conference contribution
Precise Compensation of Device Variability in IGZO-based Ferroelectric ThinFilm Transistors for Enhanced Transparent Display Performance (2024)
Joch D, Lehninger D, Sunil A, Sanctis S, Lang T, Zeltner J, Wartenberg P, et al.
Conference contribution
Investigation of CMOS Single Process Steps on 4H-SiC a-Plane Wafers for Quantum Applications (2024)
Schwarberg J, Karhu R, Kallinger B, Rommel M, Schmidt R, Schulze J
Conference contribution
Modified Approach for the Rainflow Counting Analysis of Temperature Load Signals in Power Electronics Modules (2024)
Letz S, März M, Zhao D
Conference contribution