Lehrstuhl für Elektronische Bauelemente


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Types of publications

Journal article
Book chapter / Article in edited volumes
Authored book
Translation
Thesis
Edited Volume
Conference contribution
Other publication type
Unpublished / Preprint

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Abstract

Journal

Spectrally Stable Defect Qubits with no Inversion Symmetry for Robust Spin-To-Photon Interface (2019) Udvarhelyi P, Nagy R, Kaiser F, Lee SY, Wrachtrup J, Gali A Journal article Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy (2019) Hutzler A, Matthus C, Dolle C, Rommel M, Jank MPM, Spiecker E, Frey L Journal article Parameter study on the electrical contact resistance of axially canted coil springs for high-current systems (2019) Schriefer T, Hofmann M, Rauh H, Eckardt B, März M Conference contribution, Conference Contribution Improving 5V digital 4H-SIC CMOS ics for operating at 400°C using PMOS channel implantation (2019) Albrecht M, Erlbacher T, Bauer A, Frey L Journal article, Report Towards highly integrated, automotive power SoCs using capacitors operating at 100 V implemented in TSV (2019) Grünler S, Rattmann G, Erlbacher T, Bauer AJ, Krach F, Frey L Conference contribution Experimental investigation of the gravity influence on the condensation behaviour on Al and PTFE-samples (2019) Fedorova N, Macher P, Jovicic V, Zbogar-Rasic A, Delgado A Conference contribution Silicon RC-Snubber for 900 V Applications Utilising non-Stoichiometric Silicon Nitride (2019) Boettcher N, Heckel T, Erlbacher T, Pelaic K Conference contribution Performance of 4H-SIC bipolar diodes as temperature sensor at low temperatures (2019) Di Benedetto L, Matthus C, Erlbacher T, Bauer AJ, Licciardo GD, Rubino A, Frey L Conference contribution Determination of compensation ratios of al-implanted 4H-SIC by tcad modelling of TLM measurements (2019) Kocher M, Yao B, Weiße J, Rommel M, Xu ZW, Erlbacher T, Bauer A Conference contribution Comparison between NI-SALICIDE and self-aligned lift-off used in fabrication of ohmic contacts for sic power MOSFET (2019) Śledziewski T, Erlbacher T, Bauer A, Frey L, Chen X, Zhao Y, Li C, Dai X Conference contribution