Department Werkstoffwissenschaften

Post-deposition annealing and interfacial atomic layer deposition buffer layers of Sb2Se3/CdS stacks for reduced interface recombination and increased open-circuit voltages (2022) Weiss TP, Minguez-Bacho I, Zuccala E, Melchiorre M, Valle N, El Adib B, Yokosawa T, et al. Journal article The Effect of Silicon Substitution in Indacenodithiophene-Based A2-A1-D-A1-A2-Type Nonfullerene Acceptors on the Performance of High-Voltage Organic Solar Cells (2022) Dai T, Du M, Wang H, Li X, He Z, Meng Y, Yang F, et al. Journal article Suppressing Nonradiative Recombination in Lead-Tin Perovskite Solar Cells through Bulk and Surface Passivation to Reduce Open Circuit Voltage Losses (2022) Zhang K, Späth A, Almora O, Le Corre VM, Wortmann J, Zhang J, Xie Z, et al. Journal article Development of Microstructure and Mechanical Properties of TiAl6V4 Processed by Wire and Arc Additive Manufacturing (2022) Elitzer D, Jäger S, Höll C, Baier D, Varga R, Zaeh MF, Göken M, Höppel HW Journal article High-Temperature CoNi-Based Superalloys Strengthened by γ′-(Ni,Co)3(Cr,Al,Ti,X): The Effect of Refractory Elements (2022) Liang Z, Paul JDH, Stark A, Bezold A, Neumeier S, Göken M, Pyczak F Journal article Defects caused by degradation - A stumbling block for nanocomposites in thin film capacitors (2022) Werner S, Kaschta J, Schubert DW Conference contribution Long-Term Field Screening by Mobile Ions in Thick Metal Halide Perovskites: Understanding Saturation Currents (2022) Almora O, Miravet D, Gelmetti I, Garcia-Belmonte G Journal article Laser-based additive manufacturing of bulk metallic glass-forming alloys: Processing, microstructure and properties (2022) Luo N Thesis Evolution of inverter ground impedances for PV modules with various backsheet types (2022) Buerhop C, Stroyuk O, Pickel T, Hauch J, Peters IM Journal article In Situ Monitoring Technologies as Prospective Validation Tools for Numerical Simulations of Ammonothermal Crystal Growth (2022) Schimmel S, Salamon M, Tomida D, Kobelt I, Heinlein L, Kimmel AC, Steigerwald T, et al. Conference contribution, Abstract of a poster