Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules

Sprenger M, Fegus M, Ockel M, Hechtel M, Goth C, Franke J, Risch F (2025)

Publication Type: Conference contribution

Publication year: 2025

Pages Range: 1-8

Conference Proceedings Title: 2025 International Spring Seminar on Electronics Technology (ISSE)

DOI: 10.1109/ISSE65583.2025.11120973

Abstract

Soldering or sintering as heatsink attach technology for large-area molded power modules is necessary within innovative high-performance packaging approaches but poses a special challenge to the epoxy-assembly interface throughout joining. Epoxy delamination around the etch trenches of the metal-ceramic-substrates has been deducted as general issue within heatsink attach. The plasma gas used for surface pre-treatment before epoxy encapsulation has been identified as a huge impact factor for epoxy adhesion performance throughout the attach process, delaminated surface area can differ up to $20 \%$ depending on plasma gas selection. Epoxy adhesion strength on the copper surface of the metal-ceramic-substrate has been characterized with the help of the method of shear button creation by laser ablation as well, showing similar sensitivity on chosen gas combination.

Authors with CRIS profile

Involved external institutions

Schaeffler Technologies AG & Co. KG Germany (DE)

How to cite

APA:

Sprenger, M., Fegus, M., Ockel, M., Hechtel, M., Goth, C., Franke, J., & Risch, F. (2025). Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules. In 2025 International Spring Seminar on Electronics Technology (ISSE) (pp. 1-8).

MLA:

Sprenger, Mario, et al. "Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules." Proceedings of the 2025 International Spring Seminar on Electronics Technology (ISSE) 2025. 1-8.

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