Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication

Utsch D, Häußler F, Sprenger M, Zirn J, Franke J (2023)

Publication Type: Conference contribution

Publication year: 2023

Publisher: IEEE

City/Town: New York

Conference Proceedings Title: 2023 15th International Congress Mechatronic Integration Discourse (MID)

Event location: Amberg

DOI: 10.1109/MID59615.2023.10461318

Abstract

Increasing demand for efficiency of 3D mechatronic integrated devices (MID) typically require substrates with increased temperature resistance. Thus, in this work ceramic materials such as alumina are used instead of thermoplastics. For spatial integration and freedom of design, the ceramic substrates are printed using Fused Filament Fabrication. After chemical and thermal post-treatment, conductive lines are printed on the ceramic substrates by piezojet-printing with silver-based ink and sintered in a convection furnace. The reliability of the produced specimens is assessed by testing procedures based on IEC 60068 (temperature shock test and humidity-heat-test). In the conducted tests, the printed material compound suggests to be robust to the applied conditions. Therefore, these reliability evaluations of piezojet-printed conductive lines on additively manufactured alumina indicate a promising suitability of ceramic substrates for MID.

Authors with CRIS profile

How to cite

APA:

Utsch, D., Häußler, F., Sprenger, M., Zirn, J., & Franke, J. (2023). Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication. In 2023 15th International Congress Mechatronic Integration Discourse (MID). Amberg, DE: New York: IEEE.

MLA:

Utsch, Daniel, et al. "Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication." Proceedings of the 2023 15th International Congress Mechatronic Integration Discourse, Amberg New York: IEEE, 2023.

BibTeX: Download