Thermal management in high-density power converters

März M (2003)

Publication Type: Conference contribution

Publication year: 2003

Series: IEEE Xplore

Conference Proceedings Title: Conference on Industrial Technology

Event location: Maribor SI

DOI: 10.1109/ICIT.2003.1290835

Abstract

This paper gives an overview of basic principles of the thermal management in high density power converters. Methods for heat removal on a device and circuit board level are discussed. New packaging technologies for discrete power semiconductors as well as multifunctional board integration techniques are included. A view is given on future 3D integration techniques that take into account the poor thermal conductivity especially of the passive component materials. With these techniques much higher power densities are possible. Some examples of prototype systems are presented, together with the achieved technical data.

Authors with CRIS profile

Martin März

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

März, M. (2003). Thermal management in high-density power converters. In IEEE (Eds.), Conference on Industrial Technology. Maribor, SI.

MLA:

März, Martin. "Thermal management in high-density power converters." Proceedings of the IEEE International Conference on Industrial Technology, 2003, Maribor Ed. IEEE, 2003.

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