Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity

Utsch D, Piechulek N, Franke J (2022)

Publication Type: Conference contribution

Publication year: 2022

Event location: Wien AT

DOI: 10.1109/ISSE54558.2022.9812778

Abstract

The ongoing demand for more powerful electronic assemblies requires the development of more flexible systems with substrates showing improved thermal and electrical properties. In this regard, fiber-filled polymers processed by Additive Manufacturing technologies are promising. While previous work rather focuses on the material and mechanical aspects of filled polymers and 3D printing, this work proposes an innovative approach to manufacture electronic assemblies additively using Fused Filament Fabrication with glass fiber-filled polymers to create 3D substrates and using digital printing technologies to create electrically conductive structures on the manufactured specimens. For this reason, a reduction of substrate surface roughness through systematic optimization of parameter configuration is necessary to print constant conductive lines subsequently. By this means, 3D circuit carriers for electronic assemblies with improved thermal conductivity can be produced completely additively. Surface roughness of Ra=2.6μm and Rz=42.0μm was achieved in this work, and the printed lines were qualified in optical, electrical, and mechanical regard.

Authors with CRIS profile

Daniel Utsch Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Niklas Piechulek Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Utsch, D., Piechulek, N., & Franke, J. (2022). Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity. In Proceedings of the 45th International Spring Seminar on Electronics Technology (ISSE). Wien, AT.

MLA:

Utsch, Daniel, Niklas Piechulek, and Jörg Franke. "Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity." Proceedings of the 45th International Spring Seminar on Electronics Technology (ISSE), Wien 2022.

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