Stoll T, Feuerer T, Hensel A, Franke J (2022)
Publication Type: Conference contribution
Publication year: 2022
Publisher: SPIE
Book Volume: 11992
Conference Proceedings Title: Proceedings of SPIE - The International Society for Optical Engineering
Event location: Virtual, Online
ISBN: 9781510648555
DOI: 10.1117/12.2606382
Additive Manufacturing technologies such as Laser Powder Bed Fusion (LPBF) provide several advantages compared to conventional manufacturing techniques by being cheaper, faster, more flexible and energy efficient. Therefore, they offer a huge potential for electronics packaging. Direct bonded copper substrates are a commonly used substrate technology for power electronics based on copper and alumina. This paper focuses on reflecting the state of the art in DBCtechnology by investigating the parameters different authors used in their experiments and deriving optimal settings based on these results. Furthermore, works addressing the LPBF of copper or laser-based copper processing on ceramics with and without afterward heat treatments were collected. These works were also studied and potentials, challenges as well as prospects for the LPBF-process of the adaption of the DBC-technology are presented.
APA:
Stoll, T., Feuerer, T., Hensel, A., & Franke, J. (2022). Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF). In Bo Gu, Hongqiang Chen, Henry Helvajian (Eds.), Proceedings of SPIE - The International Society for Optical Engineering. Virtual, Online: SPIE.
MLA:
Stoll, Thomas, et al. "Review of the direct bonded copper (DBC) process and its adaption to laser powder bed fusion (LPBF)." Proceedings of the Laser 3D Manufacturing IX 2022, Virtual, Online Ed. Bo Gu, Hongqiang Chen, Henry Helvajian, SPIE, 2022.
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