Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers

Lorenz L, Hanesch F, Nieweglowski K, Hamjah MK, Franke J, Hoffmann GA, Overmeyer L, Bock K (2021)


Publication Type: Conference contribution

Publication year: 2021

Journal

Publisher: IEEE COMPUTER SOC

City/Town: LOS ALAMITOS

Pages Range: 14-21

Conference Proceedings Title: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)

Event location: , ELECTR NETWORK

DOI: 10.1109/ECTC32696.2021.00014

Authors with CRIS profile

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How to cite

APA:

Lorenz, L., Hanesch, F., Nieweglowski, K., Hamjah, M.K., Franke, J., Hoffmann, G.-A.,... Bock, K. (2021). Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers. In IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (pp. 14-21). , ELECTR NETWORK: LOS ALAMITOS: IEEE COMPUTER SOC.

MLA:

Lorenz, Lukas, et al. "Reliability of 3D-Opto-MID Packages for Asymmetric Optical Bus Couplers." Proceedings of the IEEE 71st Electronic Components and Technology Conference (ECTC), , ELECTR NETWORK LOS ALAMITOS: IEEE COMPUTER SOC, 2021. 14-21.

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