Reliability of Printed Microwave Electronics

Neermann S, Franke J, Sippel M, Lomakin K, Gold G (2021)

Publication Type: Conference contribution

Publication year: 2021

Journal

Proceedings - Electronic Components and Technology Conference Institute of Electrical and Electronics Engineers

Publisher: IEEE COMPUTER SOC

City/Town: LOS ALAMITOS

Pages Range: 1791-1796

Conference Proceedings Title: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)

Event location: , ELECTR NETWORK

DOI: 10.1109/ECTC32696.2021.00283

Authors with CRIS profile

Simone Neermann Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Mark Sippel Lehrstuhl für Hochfrequenztechnik (LHFT) Konstantin Lomakin Lehrstuhl für Hochfrequenztechnik (LHFT) Gerald Gold Professur für Rechnergestützten Schaltungsentwurf

How to cite

APA:

Neermann, S., Franke, J., Sippel, M., Lomakin, K., & Gold, G. (2021). Reliability of Printed Microwave Electronics. In IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021) (pp. 1791-1796). , ELECTR NETWORK: LOS ALAMITOS: IEEE COMPUTER SOC.

MLA:

Neermann, Simone, et al. "Reliability of Printed Microwave Electronics." Proceedings of the IEEE 71st Electronic Components and Technology Conference (ECTC), , ELECTR NETWORK LOS ALAMITOS: IEEE COMPUTER SOC, 2021. 1791-1796.

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