Voigt C, Hagag A, Kirchberger M, Franke J (2021)
Publication Type: Conference contribution
Publication year: 2021
Publisher: IEEE Computer Society
Book Volume: 2021-May
Conference Proceedings Title: Proceedings of the International Spring Seminar on Electronics Technology
Event location: Bautzen, DEU
ISBN: 9781665414777
DOI: 10.1109/ISSE51996.2021.9467562
Optimization of the pin in paste (PiP) printing process requires accurate and time-efficient evaluation of solder deposits for through-hole devices (THD). In an effort to identify a methodology that provides an optimized time-To-precision ratio for the evaluation of non-pinned, non-planar solder deposits this paper evaluates the state of coaxial single image X-ray evaluation of similar volumes using grayscale referencing as applied to post reflow deposits. It proposes a precise measurement approach utilizing laser scan microscopy as a reference and furthermore evaluates the significance of various influences on the accuracy and efficacy of coaxial X-ray measurements using planar material samples. The factors evaluated in this paper include the utilization of dynamic range, image distortion caused by cone-beam geometry and homogeneity of sample material for greyscale interpolation, and calculation of absorption coefficients by statistical analysis. The accuracy achieved using coaxial X-ray imaging and subsequent pixel-wise analysis of material thickness has proven difficult for geometrically complex volumes, though consideration of the proposed factors and subsequent optimization of the evaluation algorithm could potentially increase the viability of the method as a quick and flexible way of measuring complex volumes of material.
APA:
Voigt, C., Hagag, A., Kirchberger, M., & Franke, J. (2021). Evaluation of Influences on Accuracy of Radiographic Measurements of Solder Joint Volume. In Proceedings of the International Spring Seminar on Electronics Technology. Bautzen, DEU: IEEE Computer Society.
MLA:
Voigt, Christian, et al. "Evaluation of Influences on Accuracy of Radiographic Measurements of Solder Joint Volume." Proceedings of the 44th International Spring Seminar on Electronics Technology, ISSE 2021, Bautzen, DEU IEEE Computer Society, 2021.
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