Ceramic Embedding as Packaging Solution for Future Power Electronic Applications

Bach HL, Endres T, Dirksen D, Zischler S, Bayer CF, Schletz A, März M (2018)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2018

Event location: Niigata JP

DOI: 10.23919/IPEC.2018.8507647

Abstract

This paper proposes a novel packaging concept for power electronic applications on basis of embedding power devices in ceramic circuit carriers, such as direct bonded copper (DBC) substrates. The semiconductor devices are assembled into laser structured DBC substrates and then sealed with a copper cover afterwards. This proposed method is an alternative solution to printed circuit board (PCB) embedding and low-temperature co-fired ceramic (LTCC) based multilayer technologies, which are insufficient for high power applications due to the limited temperature resistance and current carrying capacity. The feasibility study confirmed that the DBC embedding approach was successfully implemented by using laser technology combined with conductive gluing, solder, and silver sintering processes.

Authors with CRIS profile

Hoang Linh Bach Lehrstuhl für Leistungselektronik (LEE) Martin März Lehrstuhl für Leistungselektronik (LEE)

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Bach, H.L., Endres, T., Dirksen, D., Zischler, S., Bayer, C.F., Schletz, A., & März, M. (2018). Ceramic Embedding as Packaging Solution for Future Power Electronic Applications. In IEEE (Eds.), Proceedings of the 2018 IPEC International Power Electronics Conference (ECCE Asia). Niigata, JP.

MLA:

Bach, Hoang Linh, et al. "Ceramic Embedding as Packaging Solution for Future Power Electronic Applications." Proceedings of the 2018 IPEC International Power Electronics Conference (ECCE Asia), Niigata Ed. IEEE, 2018.

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