Selective Silver Sintering on Organic-Based Circuit Boards

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autorinnen und Autoren: Müller J, Novak M, Dresel F, Bayer CF, Schletz A, Endres T, März M
Jahr der Veröffentlichung: 2019
Sprache: Englisch


Abstract

Silver sintering on ceramic
circuit carriers is in mass production. The sintering on organic-based circuit
boards such as standard printed circuit boards (PCB) was developed. The sizes
of the dies were 18.5 mm² to 25.75 mm². Thereof the process can be
used for device sizes used in power electronics. Shear tests were used to draw
conclusions from the bonding strength. The highest shear strength of 16.0 MPa
was received for die transfer film (DTF) cut-out temperature 140°C, substrate
temperature 180 °C and 150 s sintering time. The PCBs were not
damaged during processing.


FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

März, Martin Prof. Dr.
Lehrstuhl für Leistungselektronik


Einrichtungen weiterer Autorinnen und Autoren

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


Zitierweisen

APA:
Müller, J., Novak, M., Dresel, F., Bayer, C.F., Schletz, A., Endres, T., & März, M. (2019). Selective Silver Sintering on Organic-Based Circuit Boards. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.

MLA:
Müller, Jonas, et al. "Selective Silver Sintering on Organic-Based Circuit Boards." Proceedings of the 2019 PCIM Europe, Nürnberg 2019.

BibTeX: 

Zuletzt aktualisiert 2019-09-07 um 09:47