Laser drop on demand micro joining for high temperature wire bonding applications - system technology and mechanical joint performance

Stein S, Dippert J, Roth S, Schmidt M (2017)

Publication Status: Published

Publication Type: Journal article, Original article

Publication year: 2017

Journal

Journal of Laser Micro Nanoengineering Japan Laser Processing Society (JLPS)

Publisher: Japan Laser Processing Society

Book Volume: 12

Pages Range: 239-247

Journal Issue: 3

DOI: 10.2961/jlmn.2017.03.0012

Authors with CRIS profile

Stefan Stein Lehrstuhl für Photonische Technologien Michael Schmidt Lehrstuhl für Photonische Technologien

Involved external institutions

Bayerisches Laserzentrum gemeinnützige Forschungsgesellschaft mbH (BLZ) DE Germany (DE)

How to cite

APA:

Stein, S., Dippert, J., Roth, S., & Schmidt, M. (2017). Laser drop on demand micro joining for high temperature wire bonding applications - system technology and mechanical joint performance. Journal of Laser Micro Nanoengineering, 12(3), 239-247. https://dx.doi.org/10.2961/jlmn.2017.03.0012

MLA:

Stein, Stefan, et al. "Laser drop on demand micro joining for high temperature wire bonding applications - system technology and mechanical joint performance." Journal of Laser Micro Nanoengineering 12.3 (2017): 239-247.

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