Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience

Journal article


Publication Details

Author(s): Herkersdorf A, Aliee H, Engel M, Glaß M, Gimmler-Dumont C, Henkel J, Kleeberger VB, Kochte MA, Kühn JM, Mueller-Gritschneder D, Nassif SR, Rauchfuss H, Rosenstiel W, Schlichtmann U, Shafique M, Tahoori MB, Teich J, Wehn N, Weis C, Wunderlich HJ
Journal: Microelectronics Reliability
Publisher: Elsevier
Publication year: 2014
Volume: 54
Journal issue: 6-7
Pages range: 1066-1074
ISSN: 0026-2714


FAU Authors / FAU Editors

Aliee, Hananeh
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)
Glaß, Michael Prof. Dr.-Ing.
Juniorprofessur für Informatik
Teich, Jürgen Prof. Dr.-Ing.
Lehrstuhl für Informatik 12 (Hardware-Software-Co-Design)


External institutions with authors

Eberhard Karls Universität Tübingen
IBM Zurich Research Laboratory
Karlsruhe Institute of Technology (KIT)
Technische Universität Dortmund
Technische Universität Kaiserslautern
Technische Universität München (TUM)
Universität Stuttgart


How to cite

APA:
Herkersdorf, A., Aliee, H., Engel, M., Glaß, M., Gimmler-Dumont, C., Henkel, J.,... Wunderlich, H.-J. (2014). Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience. Microelectronics Reliability, 54(6-7), 1066-1074. https://dx.doi.org/10.1016/j.microrel.2013.12.012

MLA:
Herkersdorf, Andreas, et al. "Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience." Microelectronics Reliability 54.6-7 (2014): 1066-1074.

BibTeX: 

Last updated on 2018-10-08 at 05:58