Selective Silver Sintering on Organic-Based Circuit Boards

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Müller J, Novak M, Dresel F, Bayer CF, Schletz A, Endres T, März M
Publication year: 2019
Language: English


Abstract

Silver sintering on ceramic
circuit carriers is in mass production. The sintering on organic-based circuit
boards such as standard printed circuit boards (PCB) was developed. The sizes
of the dies were 18.5 mm² to 25.75 mm². Thereof the process can be
used for device sizes used in power electronics. Shear tests were used to draw
conclusions from the bonding strength. The highest shear strength of 16.0 MPa
was received for die transfer film (DTF) cut-out temperature 140°C, substrate
temperature 180 °C and 150 s sintering time. The PCBs were not
damaged during processing.


FAU Authors / FAU Editors

März, Martin Prof. Dr.
Lehrstuhl für Leistungselektronik


External institutions with authors

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


How to cite

APA:
Müller, J., Novak, M., Dresel, F., Bayer, C.F., Schletz, A., Endres, T., & März, M. (2019). Selective Silver Sintering on Organic-Based Circuit Boards. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.

MLA:
Müller, Jonas, et al. "Selective Silver Sintering on Organic-Based Circuit Boards." Proceedings of the 2019 PCIM Europe, Nürnberg 2019.

BibTeX: 

Last updated on 2019-09-07 at 09:47