Dreher P, Schmidt R, Vetter A, Hepp J, Karl A, Brabec C (2018)
Publication Language: English
Publication Status: Published
Publication Type: Journal article, Original article
Publication year: 2018
Publisher: Elsevier Ltd
Book Volume: 88-90
Pages Range: 365-370
DOI: 10.1016/j.microrel.2018.07.121
In typical power electronic modules several semiconductor dies such as MOSFET or IGBT are soldered to a DBC
substrate. During module production the quality of the solder layers can be monitored by the use of X-ray
inspection and the void rate can be determined. Recently, the more robust Ag-sinter technology is deployed for attaching the power dies to the substrate, especially for high reliability or high temperature requirements. Besides voiding also adhesion problems can occur during sintering due to multiple reasons (e.g. contamination). In contrast to volume defects, pure adhesion problems cannot be detected by means of X-rays. Accordingly, other methods have to be applied for process monitoring. The present investigation compares the advantages and disadvantages of different non-destructive imaging techniques towards the detection of defects in sinter layers. Besides X-ray, Scanning Acoustic Microscopy (SAM) and Lock-in Thermography methods (DLIT+ILIT) were studied and evaluated in terms of suitability for detecting different defect types, resolution (minimum defect sizes), inspection time and possible integration into the assembly process.
APA:
Dreher, P., Schmidt, R., Vetter, A., Hepp, J., Karl, A., & Brabec, C. (2018). Non-destructive imaging of defects in Ag-sinter die attach layers – A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography. Microelectronics Reliability, 88-90, 365-370. https://doi.org/10.1016/j.microrel.2018.07.121
MLA:
Dreher, P., et al. "Non-destructive imaging of defects in Ag-sinter die attach layers – A comparative study including X-ray, Scanning Acoustic Microscopy and Thermography." Microelectronics Reliability 88-90 (2018): 365-370.
BibTeX: Download