Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience

Herkersdorf A, Aliee H, Engel M, Glaß M, Gimmler-Dumont C, Henkel J, Kleeberger VB, Kochte MA, Kühn JM, Mueller-Gritschneder D, Nassif SR, Rauchfuss H, Rosenstiel W, Schlichtmann U, Shafique M, Tahoori MB, Teich J, Wehn N, Weis C, Wunderlich HJ (2014)


Publication Type: Journal article

Publication year: 2014

Journal

Publisher: Elsevier

Book Volume: 54

Pages Range: 1066-1074

Journal Issue: 6-7

DOI: 10.1016/j.microrel.2013.12.012

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How to cite

APA:

Herkersdorf, A., Aliee, H., Engel, M., Glaß, M., Gimmler-Dumont, C., Henkel, J.,... Wunderlich, H.-J. (2014). Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience. Microelectronics Reliability, 54(6-7), 1066-1074. https://doi.org/10.1016/j.microrel.2013.12.012

MLA:

Herkersdorf, Andreas, et al. "Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-Chip Resilience." Microelectronics Reliability 54.6-7 (2014): 1066-1074.

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