Process development for the manufacturing of 99.94% pure copper via selective electron beam melting

Journal article
(Original article)


Publication Details

Author(s): Lodes M, Guschlbauer R, Körner C
Journal: Materials Letters
Publisher: Elsevier
Publication year: 2015
Volume: 143
Pages range: 298-301
ISSN: 1873-4979
Language: English


Abstract


The additive processing of 99.94% pure copper powder via selective electron beam melting (SEBM) is presented. The high thermal and electrical conductivity of pure copper combined with the freedom in design in additive manufacturing is promising for future application e.g. as heat exchanger. A process window for the generation of dense copper parts could be evaluated. Despite the high thermal conductivity, comparatively low build temperatures have to be used due to the high sintering tendency of the powder. The latter also limits the maximum power input during melting.



FAU Authors / FAU Editors

Guschlbauer, Ralf
Zentralinstitut für Neue Materialien und Prozesstechnik
Körner, Carolin Prof. Dr.-Ing.
Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle)
Lodes, Matthias Dr.-Ing.
Zentralinstitut für Neue Materialien und Prozesstechnik


How to cite

APA:
Lodes, M., Guschlbauer, R., & Körner, C. (2015). Process development for the manufacturing of 99.94% pure copper via selective electron beam melting. Materials Letters, 143, 298-301. https://dx.doi.org/10.1016/j.matlet.2014.12.105

MLA:
Lodes, Matthias, Ralf Guschlbauer, and Carolin Körner. "Process development for the manufacturing of 99.94% pure copper via selective electron beam melting." Materials Letters 143 (2015): 298-301.

BibTeX: 

Last updated on 2018-19-04 at 03:52