Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications

Beitrag in einer Fachzeitschrift


Details zur Publikation

Autor(en): Steinhäußer F, Talai A, Sandulache G, Weigel R, Kölpin A, Hansal W, Bittner A, Schmid U
Zeitschrift: Microelectronics Reliability
Verlag: Elsevier
Jahr der Veröffentlichung: 2016
Band: 60
Seitenbereich: 93-100
ISSN: 0026-2714


Abstract


Advanced high frequency systems such as needed in modern radar applications, require high conductive metallizations as well as substrates with areas of variable permittivity. This paper presents the combination of the selective porosification technology of low temperature co-fired ceramics and electro pulse plated silver microstrip lines. By means of selective plating methods, line widths of 20 μm can be manufactured featuring low resistivity values down to 2.33 μΩ·cm, without detectable pore penetration. The substrate permittivity is measured facilitating a combined method of ring resonator detuning and 3D field simulations resulting in a reduction of 6.5\% with a shift from approx. 7.52 to 7.03 at 66 GHz due to the porosification. As often outlined in literature the major challenge in using silver as a conductor lies in its high tendency of agglomeration and microstructural transformation especially in oxygen containing atmosphere even at low temperatures. Therefore, the effect of different temperature loads up to 500°C on the dc film resistivity are measured using the VAN DER PAUW technique and compared to scanning electron microscope analyses.



FAU-Autoren / FAU-Herausgeber

Kölpin, Alexander PD Dr.
Lehrstuhl für Technische Elektronik
Talai, Armin
Lehrstuhl für Technische Elektronik
Weigel, Robert Prof. Dr.-Ing.
Lehrstuhl für Technische Elektronik


Autor(en) der externen Einrichtung(en)
Technische Universität Wien


Zitierweisen

APA:
Steinhäußer, F., Talai, A., Sandulache, G., Weigel, R., Kölpin, A., Hansal, W.,... Schmid, U. (2016). Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications. Microelectronics Reliability, 60, 93-100. https://dx.doi.org/10.1016/j.microrel.2016.02.010

MLA:
Steinhäußer, Frank, et al. "Pulse Plated Silver Metallization on Porosified Low Temperature Co-fired Ceramics for High Frequency Applications." Microelectronics Reliability 60 (2016): 93-100.

BibTeX: 

Zuletzt aktualisiert 2018-06-08 um 18:38