Matthias Petersen


Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Publications (Download BibTeX)

Lomakin, K., Pavlenko, T., Ankenbrand, M., Sippel, M., Ringel, J., Scheetz, M.,... Gold, G. (2018). Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material. IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-1.
Ankenbrand, M., Scheetz, M., Franke, J., Lomakin, K., Sippel, M., Gold, G., & Helmreich, K. (2018). Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies. In Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID).
Hensel, A., Schwarzer, C., Scheetz, M., Kaloudis, M., & Franke, J. (2018). Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations. In 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (pp. 416-421). Singapore, SG: NEW YORK: IEEE.
Gräf, D., Neermann, S., Stuber, L., Scheetz, M., & Franke, J. (2018). Pushing the Boundaries of 3D-MID: Pulse-Width Modulated Light Technology for Enhancing Surface Properties and Enabling Printed Electronics on FFF-Printed Structures. In 2018 13th International Congress Molded Interconnect Devices (MID) (pp. 1-5).
Neermann, S., Scheetz, M., Franke, J., Roudenko, J., Schirmer, J., & Reichenberger, M. (2018). Substrate pretreatments: an investigation of the effects on aerosol jet printed structures. In Schmitt, Schuh (Hg.) 2018 – Advances in Production Research (Eds.), Proceedings of the WGP-Jahreskongress.

Last updated on 2019-01-07 at 23:51