Franz Xaver Röhrl



Organisationseinheit


Lehrstuhl für Technische Elektronik


Preise / Auszeichnungen


2019 : Bester Beitrag in den proceedings einer internationalen Konferenz 2018


Publikationen (Download BibTeX)


Jakob, J., Sammer, R., Röhrl, F.X., Zorn, S., & Bogner, W. (2019). WR12 to planar transmission line transition on organic substrate. In Proceedings of the European Microwave Conference 2019 (pp. 4). Paris, FR.
Röhrl, F.X., Jakob, J., Bogner, W., Weigel, R., & Zorn, S. (2018). Bare Die Connections via Aerosol Jet Technology for Millimeter Wave Applications. In Proceedings of the European Microwave Conference (pp. 4). Madrid, ES: IEEE.
Röhrl, F.X., Sammer, R., Jakob, J., Bogner, W., Weigel, R., Hassel, U., & Zorn, S. (2017). Cost-Effective SIW Band-Pass Filters for Millimeter Wave Applications - A method to combine low tolerances and low prices on standard pcb substrates. Nürnberg, DE.
Röhrl, F.X., Bogner, W., Jakob, J., Hageneder, D., & Zorn, S. (2016). Differential wideband interconnects for organic millimeter wave chip packages - An effort to design an all-purpose RF chip package. London, GB: IEEE.
Röhrl, F.X., Bogner, W., Jakob, J., & Hageneder, D. (2015). Wideband RF Interconnects for Organic Chip Packages - Comparison of single ended and differential transitions. Paris, FR.

Zuletzt aktualisiert 2017-20-04 um 05:35