Institute of Semiconductors

Research facility

Beijing, China

Publications in cooperation with FAU scientists

Lin, L., Ou, Y., Jokubavicius, V., Syväjärvi, M., Liang, M., Liu, Z.,... Ou, H. (2019). An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications. Materials Science in Semiconductor Processing, 91, 9-12.

Last updated on 2018-14-11 at 13:43