Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


Forschungseinrichtung

Standort der Organisation:
Erlangen, Deutschland


Forschungsprojekte mit FAU-Wissenschaftlerinnen und Wissenschaftlern


(EXC 315: Neue Materialien und Prozesse - Hierarchische Strukturbildung für funktionale Bauteile):
EXC 315/2: Engineering of Nanoelectronic Materials - B6 (Printed Electronics)
Prof. Dr. Lothar Frey
(01.11.2012 - 31.10.2017)
(Solarfabrik der Zukunft: Smart Grid Solar):
Implementierung im Marktumfeld
Prof. Dr. Veronika Grimm; Prof. Dr. Gregor Zöttl
(01.06.2012 - 31.05.2017)


Publikationen in Kooperation mit FAU-Wissenschaftlerinnen und Wissenschaftlern


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Schriefer, T., & Hofmann, M. (2019). A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices. Microelectronics Reliability, 98, 86-94. https://dx.doi.org/10.1016/j.microrel.2019.04.001
Weiße, J., Hauck, M., Krieger, M., Bauer, A., & Erlbacher, T. (2019). Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC. AIP Advances, 9(5), 055308. https://dx.doi.org/10.1063/1.5096440
Jung, S., Matlok, S., Eckardt, B., & März, M. (2019). Analysis of a mixed transfer function and state space implementation of cascade control. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Endruschat, A., Novak, C., Gerstner, H., Heckel, T., Joffe, C., & März, M. (2019). A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Transistors. IEEE Transactions on Power Electronics, 34(9), 9131-9145. https://dx.doi.org/10.1109/TPEL.2018.2889513
Torcoli, M., Freke-Morin, A., Paulus, J., Simon, C., & Shirley, B. (2019). Background ducking to produce esthetically pleasing audio for TV with clear speech. In AES 146th International Convention. Dublin, IE: Audio Engineering Society.
Schulz, M., Kaiser, J., Gosses, K., Conz, R., & März, M. (2019). Bidirectional Bipolar Electronic Overcurrent Safety Elements for Bipolar DC Grids. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Ehrlich, S., Joffe, C., Thielke, H., Leinfelder, M., & März, M. (2019). Comprehensive SPICE model for power inductor losses. In Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC (pp. 1237-1244). Anaheim, CA, US: Institute of Electrical and Electronics Engineers Inc..
Eckstein, M., Sailer, V., Nielsen, B.S., Wittenberg, T., Wiesmann, V., Lieb, V.,... Wach, S. (2019). Co-staining of microRNAs and their target proteins by miRNA in situ hybridization and immunohistofluorescence on prostate cancer tissue microarrays. Laboratory Investigation. https://dx.doi.org/10.1038/s41374-019-0251-8
Matthus, C.D., Di Benedetto, L., Kocher, M., Bauer, A.J., Licciardo, G.D., Rubino, A., & Erlbacher, T. (2019). Feasibility of 4H-SiC p-i-n Diode for Sensitive Temperature Measurements Between 20.5 K and 802 K. IEEE Sensors Journal, 19(8), 2871-2878. https://dx.doi.org/10.1109/JSEN.2019.2891293
Hutzler, A., Matthus, C., Dolle, C., Rommel, M., Jank, M.P.M., Spiecker, E., & Frey, L. (2019). Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy. Journal of Physical Chemistry C. https://dx.doi.org/10.1021/acs.jpcc.9b00957
Zorenko, T., Paprocki, K., Levchuk, I., Batentschuk, M., Epelbaum, B., Fedorov, A., & Zorenko, Y. (2019). Luminescent properties of Ce3+ doped LiLuP4O12 tetraphosphate under synchrotron radiation excitation. Journal of Luminescence, 210, 47-51. https://dx.doi.org/10.1016/j.jlumin.2019.02.016
Würll, R., Robert, J., Kilian, G., & Heuberger, G. (2019). Optimal One-Shot Detection of Preambles with Frequency Offset. In International Symposium on Advanced Networks and Telecommunication Systems, ANTS. Indore, IN: IEEE Computer Society.
Yu, Z., Wang, S., Letz, S., Bayer, C.F., Häußler, F., Schletz, A., & Suganuma, K. (2019). Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments. In 2019 International Conference on Electronics Packaging (ICEP). Niigata, Japan, JP.
Schriefer, T., Hofmann, M., Rauh, H., Eckardt, B., & März, M. (2019). Parameter study on the electrical contact resistance of axially canted coil springs for high-current systems. In IEEE (Eds.), Proceedings of the 2018 29th International Conference on Electrical Contacts together with 64th IEEE Holm Conference on Electrical Contacts. Albuquerque, NM, US.
Hutzler, A., Fritsch, B., Jank, M.P.M., Branscheid, R., Spiecker, E., & März, M. (2019). Preparation of Graphene-Supported Microwell Liquid Cells for In Situ Transmission Electron Microscopy. Journal of Visualized Experiments, 149. https://dx.doi.org/10.3791/59751
Matlok, S., Boettcher, N., Jahn, M., Hörauf, P., Erlbacher, T., & Eckardt, B. (2019). Retrofitting Wide Band Gap Devices to classic Power Modules using Silicon RC Snubbers. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Matlok, S., Boettcher, N., Jahn, M., Hörauf, P., Erlbacher, T., & Eckardt, B. (2019). Retrofitting Wide Band Gap Devices to classic Power Modules using Silicon RC Snubbers. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Matlok, S., Boettcher, N., Jahn, M., Hörauf, P., Erlbacher, T., Eckardt, B., & März, M. (2019). Retrofitting Wide Band Gap Devices to classic Power Modules using Silicon RC Snubbers. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Müller, J., Novak, M., Dresel, F., Bayer, C.F., Schletz, A., Endres, T., & März, M. (2019). Selective Silver Sintering on Organic-Based Circuit Boards. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Matthus, C.D., Bauer, A.J., Frey, L., & Erlbacher, T. (2019). Wavelength-selective 4H-SiC UV-sensor array. Materials Science in Semiconductor Processing, 90, 205-211. https://dx.doi.org/10.1016/j.mssp.2018.10.019

Zuletzt aktualisiert 2017-22-08 um 14:19