Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


Standort der Organisation:
Erlangen, Deutschland

Forschungsprojekte mit FAU-Wissenschaftlerinnen und Wissenschaftlern

LZE: Leistungszentrum Elektroniksysteme (LZE)
Prof. Dr. Kathrin Möslein; Prof. Dr. Angela Roth
(01.01.2014 - 31.12.2017)
(EXC 315: Neue Materialien und Prozesse - Hierarchische Strukturbildung für funktionale Bauteile):
EXC 315/2: Engineering of Nanoelectronic Materials - B6 (Printed Electronics)
Prof. Dr. Lothar Frey
(01.11.2012 - 31.10.2017)
(Solarfabrik der Zukunft: Smart Grid Solar):
Implementierung im Marktumfeld
Prof. Dr. Veronika Grimm; Prof. Dr. Gregor Zöttl
(01.06.2012 - 31.05.2017)

Publikationen in Kooperation mit FAU-Wissenschaftlerinnen und Wissenschaftlern

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Schriefer, T., & Hofmann, M. (2019). A hybrid frequency-time-domain approach to determine the vibration fatigue life of electronic devices. Microelectronics Reliability, 98, 86-94.
Weiße, J., Hauck, M., Krieger, M., Bauer, A., & Erlbacher, T. (2019). Aluminum acceptor activation and charge compensation in implanted p-type 4H-SiC. AIP Advances, 9(5), 055308.
Jung, S., Matlok, S., Eckardt, B., & März, M. (2019). Analysis of a mixed transfer function and state space implementation of cascade control. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Genc, P., & Hassan, T. (2019). Analysis of Personality Dependent Differences in Pupillary Response and its Relation to Stress Recovery Ability. In 2019 IEEE International Conference on Pervasive Computing and Communications Workshops, PerCom Workshops 2019 (pp. 505-510). Kyoto, JP: Institute of Electrical and Electronics Engineers Inc..
Erdmann, A., Evanschitzky, P., Mesilhy, H.M.S., Philipsen, V., Hendrickx, E., & Bauer, M. (2019). Attenuated phase shift mask for extreme ultraviolet: Can they mitigate three-dimensional mask effects? Journal of Micro-Nanolithography MEMS and MOEMS, 18(1).
Endruschat, A., Novak, C., Gerstner, H., Heckel, T., Joffe, C., & März, M. (2019). A Universal SPICE Field-Effect Transistor Model Applied on SiC and GaN Transistors. IEEE Transactions on Power Electronics, 34(9), 9131-9145.
Torcoli, M., Freke-Morin, A., Paulus, J., Simon, C., & Shirley, B. (2019). Background ducking to produce esthetically pleasing audio for TV with clear speech. In AES 146th International Convention. Dublin, IE: Audio Engineering Society.
Schulz, M., Kaiser, J., Gosses, K., Conz, R., & März, M. (2019). Bidirectional Bipolar Electronic Overcurrent Safety Elements for Bipolar DC Grids. In Proceedings of the 2019 PCIM Europe. Nürnberg, DE.
Ehrlich, S., Joffe, C., Thielke, H., Leinfelder, M., & März, M. (2019). Comprehensive SPICE model for power inductor losses. In Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC (pp. 1237-1244). Anaheim, CA, US: Institute of Electrical and Electronics Engineers Inc..
Eckstein, M., Sailer, V., Nielsen, B.S., Wittenberg, T., Wiesmann, V., Lieb, V.,... Wach, S. (2019). Co-staining of microRNAs and their target proteins by miRNA in situ hybridization and immunohistofluorescence on prostate cancer tissue microarrays. Laboratory Investigation.
Erlekampf, J., Kallinger, B., Weiße, J., Rommel, M., Berwian, P., Friedrich, J., & Erlbacher, T. (2019). Deeper insight into lifetime-engineering in 4H-SiC by ion implantation. Journal of Applied Physics, 126(4).
Matthus, C.D., Di Benedetto, L., Kocher, M., Bauer, A.J., Licciardo, G.D., Rubino, A., & Erlbacher, T. (2019). Feasibility of 4H-SiC p-i-n Diode for Sensitive Temperature Measurements Between 20.5 K and 802 K. IEEE Sensors Journal, 19(8), 2871-2878.
Arzig, M., Steiner, J., Salamon, M., Uhlmann, N., & Wellmann, P. (2019). Influence of morphological changes in a source material on the growth interface of 4H-SiC single crystals. Materials, 12(16).
März, M., & Oechsner, R. (2019). Innovative Technologien für intelligente dezentrale Energiesysteme. Fraunhofer-Verlag.
Hutzler, A., Fritsch, B., Jank, M., Branscheid, R., Martens, R., Spiecker, E., & März, M. (2019). In Situ Liquid Cell TEM Studies on Etching and Growth Mechanisms of Gold Nanoparticles at a Solid-Liquid-Gas Interface. Advanced Materials Interfaces.
Hutzler, A., Matthus, C., Dolle, C., Rommel, M., Jank, M.P.M., Spiecker, E., & Frey, L. (2019). Large-Area Layer Counting of Two-Dimensional Materials Evaluating the Wavelength Shift in Visible-Reflectance Spectroscopy. Journal of Physical Chemistry C, 123, 9192 - 9201.
Zorenko, T., Paprocki, K., Levchuk, I., Batentschuk, M., Epelbaum, B., Fedorov, A., & Zorenko, Y. (2019). Luminescent properties of Ce3+ doped LiLuP4O12 tetraphosphate under synchrotron radiation excitation. Journal of Luminescence, 210, 47-51.
Rattmann, G., Pichler, P., & Erlbacher, T. (2019). On a Novel Source Technology for Deep Aluminum Diffusion for Silicon Power Electronics. physica status solidi (a).
Würll, R., Robert, J., Kilian, G., & Heuberger, G. (2019). Optimal One-Shot Detection of Preambles with Frequency Offset. In International Symposium on Advanced Networks and Telecommunication Systems, ANTS. Indore, IN: IEEE Computer Society.
Yu, Z., Wang, S., Letz, S., Bayer, C.F., Häußler, F., Schletz, A., & Suganuma, K. (2019). Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments. In 2019 International Conference on Electronics Packaging (ICEP). Niigata, Japan, JP.

Zuletzt aktualisiert 2017-22-08 um 14:19