Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Customizable Capacitive Sensor System Using Printed Electronics on Window Glass (2020) Fröhlich J, Gräf D, Franke J, Hörber J, Hedges M Conference contribution Qualification of NIR, UV and Laser Irradiation as Alternative Photonic Sintering Methods for Printed Electronics (2020) Neermann S, Steindl M, Franke J, Mayer E, Schmidt M Conference contribution Skinning of insulated copper wires within the production chain of hairpin windings for electric traction drives (2020) Gläßel T, Seefried J, Kühl A, Franke J Journal article Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packaging (2020) Häußler F, Shen S, Petillon S, Weser S, Haybat M, Eberhardt W, Zimmermann A, Franke J Journal article Geschäftsmodell-Muster für digitale B2B-Plattformen (2020) Löwen U, Hartner F Conference contribution Kommunikationsbedürfnisse flexibler Produktionsanlagen (2020) Vukovic P, Franke J Conference contribution Power Cycle Testing at Low Temperature Swings – Evaluating the Stability of SAC- and SnSb-based Chip Solder Layers (2020) Schmidt R, Kaesbauer M, Sippel M, Dreher P Conference contribution Correlation between Residual Stress, Building Angle and Illumination Parameters of Additive Manufactured FeSi6.5 and Mechanical and Magnetic Properties (2020) Urban N, Detrois J, Franke J Conference contribution Geschäftsmodell-Muster für digitale B2B-Plattformen (2020) Löwen U, Hartner F Conference contribution, Conference Contribution A new development of micro-copper sinter material for high power electronics application (2020) Schwarzer C, Chew LM, Stoll T, Franke J, Kaloudis M Conference contribution