Publications (149,900)

Improving the reliability of power modules through layered diffusion solder interconnects – Comparative study based on experiments and FE-simulation

Ottinger B, Mathew A, König S, Albrecht J, Sprenger M, Müller L, Goth C, Franke J (2023)

Journal article

Muhammad M, Alshraa A, German R (2023)

Conference contribution, Conference Contribution

Paul H (2023)

Journal article, other

Zimmermann M, Larena-Avellaneda A, Rother U, Lareyre F, Søgaard M, Tulamo R, Venermo M, Behrendt CA (2023)

Journal article

Zhang L, Kempf A, Nehlmeier I, Cossmann A, Dopfer-Jablonka A, Stankov MV, Schulz S, et al. (2023)

Journal article

Engel B (2023)

Journal article

Werner F, Unger C (2023)

Journal article

Gorkotte J, Weinhold B, Unger C (2023)

Journal article

Knop F, Paulus K (2023)

Journal article

Ostgathe C, Jäger C (2023)

Journal article

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