Hubert F, Wohlrath M, Zitzelsberger T, Paulwitz C, Kloska S, Guethe J, Schraink KH (2026)
Publication Type: Conference contribution, Conference Contribution
Publication year: 2026
Pages Range: 664-669
Event location: Dallas, TX
This paper discusses the standardization activities of CISPR and IEC regarding the newly introduced requirements for multimedia devices with radio functions. The current valid versions of CISPR 32 and IEC 61000-6-3 do not yet require consideration of intermodulation effects between the unintended emissions of the equipment under test and the intended emissions of permanently integrated radio transmitters such as WiFi, Bluetooth, etc. The latest committee drafts (CD) and the final draft of international standards (FDIS) include additional testing requirements for intermodulation effects. These requirements, due to the proposed unspecific measurement methods, have a major impact on manufacturers and EMC testing laboratories. To characterize the effects of intermodulation, simulations and measurements were performed on devices that include radio functionality (so called “combined equipment”). These preliminary assessments showed no significant effects that indicate a risk of non-compliance. Therefore, the standards awaiting publication do not reflect the actual effects on radiated emissions caused by intermodulation. The proposed requirements will result in increased resource demands for testing laboratories and manufacturers.
APA:
Hubert, F., Wohlrath, M., Zitzelsberger, T., Paulwitz, C., Kloska, S., Guethe, J., & Schraink, K.-H. (2026). Intermodulation Effects of Devices Combined with Radio Equipment – Test Procedures and Challenges According to CISPR 32 and IEC 61000-6-3. In Proceedings of the 2026 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY (pp. 664-669). Dallas, TX.
MLA:
Hubert, Florian, et al. "Intermodulation Effects of Devices Combined with Radio Equipment – Test Procedures and Challenges According to CISPR 32 and IEC 61000-6-3." Proceedings of the 2026 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY, Dallas, TX 2026. 664-669.
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