Surface quality and relative density within the dimensionless process window onset for low alloyed steel in PBF-LB/M with beam shaping

Marschall M, Döring M, Chechik L, Schmidt M, Bartels D (2026)


Publication Type: Conference contribution

Publication year: 2026

Journal

Publisher: Elsevier B.V.

Book Volume: 143

Pages Range: 637-642

Conference Proceedings Title: Procedia CIRP

Event location: Heinrich-Lades-Halle, DEU

DOI: 10.1016/j.procir.2026.07.134

Abstract

Parameter studies in PBF-LB/M are common but are difficult to compare due to variations in material or machine conditions. Volume energy density (VED) is frequently used to condense process parameters into a single, simplified metric. However, VED is not suitable for scaling between machines and materials. Using a low alloy steel as an example, a full-factorial parameter study, including beam shaping, is presented and evaluated in terms of density and surface roughness using VED and two existing dimensionless approaches based on the Peclet number. The influence of varying layer height is analyzed and discussed. Both dimensionless approaches enable process parameter scaling within the discussed constraints. The process stabilization at the process window onset through beam shaping is demonstrated while the required energy input for comparable density and roughness is reduced. Surface roughness proves as a reliable indicator of process stability at the process window onset, particularly for shaped beam configurations.

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How to cite

APA:

Marschall, M., Döring, M., Chechik, L., Schmidt, M., & Bartels, D. (2026). Surface quality and relative density within the dimensionless process window onset for low alloyed steel in PBF-LB/M with beam shaping. In Procedia CIRP (pp. 637-642). Heinrich-Lades-Halle, DEU: Elsevier B.V..

MLA:

Marschall, Maximilian, et al. "Surface quality and relative density within the dimensionless process window onset for low alloyed steel in PBF-LB/M with beam shaping." Proceedings of the 14th CIRP Conference on Photonic Technologies, LANE 2026, Heinrich-Lades-Halle, DEU Elsevier B.V., 2026. 637-642.

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