Silver reduction through direct wire bonding for Silicon Heterojunction solar cells
Liu Y, Peters IM, Ding K, Pieters B, Bittkau K, Rau U, Yacouba MI, Gattermann H, Lauterbach V, Lambertz A (2025)
Publication Type: Journal article
Publication year: 2025
Journal
Book Volume: 282
Article Number: 113412
DOI: 10.1016/j.solmat.2025.113412
Abstract
This study introduces Direct Wire Bonding (DWB) as a low-temperature method for interconnecting finger-free Silicon Heterojunction (SHJ) solar cells using low-cost, highly conductive copper wires. The wires are attached to the SHJ cells via discrete pads of conductive paste, enabling direct current extraction from the indium tin oxide (ITO) layer and facilitating transport to sequentially connected cells. We describe the DWB fabrication process and demonstrate its potential by comparing its performance to that of traditional SHJ modules. Our test devices show that DWB modules achieve competitive efficiencies, 0.03 % abs. higher in experiments than the 0BB and multi-wire solutions—while significantly reducing material consumption. In the study we give an outlook on the possible improvement in efficiency. The economic analysis further demonstrates that DWB can reduce production costs to as low as 18 % of the cost of other SHJ metallization and interconnection techniques. These initial results suggest that DWB is a cost-effective solution that addresses both economic and material scarcity challenges in the photovoltaic industry.
Involved external institutions
Germany (DE)How to cite
APA:
Liu, Y., Peters, I.M., Ding, K., Pieters, B., Bittkau, K., Rau, U.,... Lambertz, A. (2025). Silver reduction through direct wire bonding for Silicon Heterojunction solar cells. Solar Energy Materials and Solar Cells, 282. https://doi.org/10.1016/j.solmat.2025.113412
MLA:
Liu, Yanxin, et al. "Silver reduction through direct wire bonding for Silicon Heterojunction solar cells." Solar Energy Materials and Solar Cells 282 (2025).
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