Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices

Ankenbrand M, Naphe TU, Gohlke F, Siah KS, Franke J, Risch F (2025)

Publication Type: Conference contribution

Publication year: 2025

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2025 16th International MID Congress Mechatronic Integration Discourse, MID Congress 2025

Event location: Amberg DE

ISBN: 9798331566722

DOI: 10.1109/MIDCongress66428.2025.11547394

Abstract

This paper investigates the use of Wire Encapsulating Additive Manufacturing (WEAM) for the production of Mechatronic Integrated Devices (3D-MID) and analyzes the achievable electrical and mechanical properties. WEAM enables the placement and encapsulation of wires directly onto 3D surfaces. The system uses a specialized tool head that combines a wire feeder with a Fused Filament Fabrication (FFF) extruder. The wire is dispensed directly beneath a stream of molten polymer extruded from the nozzle, allowing it to be fixed and encapsulated in a single step. A wire-cutting mechanism incorporated in the assembly ensures precise segmentation of the wire. The entire assembly is mounted on a rotary unit that dynamically aligns the wire with the toolpath.Material combinations including polylactic acid (PLA) and a polycarbonate-polybutylene terephthalate (PC-PBT) blend for the substrate and insulation, as well as copper and nichrome wires for the conductor, are explored. The capabilities of the WEAM tool head mounted in a CNC system are evaluated using geometrical designs relevant to industrial applications. Conductive traces capable of carrying high current densities over longer distances can be fabricated in much shorter time than with other 3D-MID manufacturing technologies. Use cases such as a heating pad and a resistive bending sensor are successfully demonstrated. Nichrome is used for fabrication with additive manufacturing to print both sensors and heaters, which is generally not possible with other 3D-MID manufacturing technologies. In addition to imparting electrical properties, the embedded wires simultaneously improve the mechanical properties of the substrate material.

Authors with CRIS profile

Markus Ankenbrand Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Tanmay Ulhas Naphe Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Kok Siong Siah Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Florian Risch Professur für Montagetechnologien elektrischer Energiespeicher

Involved external institutions

KRONOS Mechatronics GmbH DE Germany (DE)

How to cite

APA:

Ankenbrand, M., Naphe, T.U., Gohlke, F., Siah, K.S., Franke, J., & Risch, F. (2025). Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices. In 2025 16th International MID Congress Mechatronic Integration Discourse, MID Congress 2025. Amberg, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Ankenbrand, Markus, et al. "Investigating Wire Encapsulating Additive Manufacturing for Mechatronic Integrated Devices." Proceedings of the 16th International MID Congress Mechatronic Integration Discourse, MID Congress 2025, Amberg Institute of Electrical and Electronics Engineers Inc., 2025.

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