Challenges for High-Datarate Chip-To-Chip Interconnects using Organic Interposer Materials for Heterogeneous Chiplet Systems Up to 110 GHz

Löffler J, Koch M, Breun S, Weigel R, Franchi N (2025)

Publication Type: Conference contribution

Publication year: 2025

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: Asia-Pacific Microwave Conference Proceedings, APMC

Event location: Jeju Island

ISBN: 9798331534554

DOI: 10.1109/APMC65046.2025.11376712

Abstract

This paper presents an overview of key challenges that arise during the development of broadband signal lines on organic interposer substrates for heterogeneous chiplet systems. This work identifies and analyzes four critical aspects that significantly impact signal integrity at high frequencies. Conductor surface roughness, surface plating effects, manufacturing process variations and the complexity of accurate crosstalk measurement. To validate the discussed effects, simulations and benchmark measurements were performed using an advanced 110 GHz 8-port VNA setup. This enable the designer to tackle these challenges starting right at the beginning of the design flow by choosing correct modeling approaches.

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How to cite

APA:

Löffler, J., Koch, M., Breun, S., Weigel, R., & Franchi, N. (2025). Challenges for High-Datarate Chip-To-Chip Interconnects using Organic Interposer Materials for Heterogeneous Chiplet Systems Up to 110 GHz. In Asia-Pacific Microwave Conference Proceedings, APMC. Jeju Island, KR: Institute of Electrical and Electronics Engineers Inc..

MLA:

Löffler, Jens, et al. "Challenges for High-Datarate Chip-To-Chip Interconnects using Organic Interposer Materials for Heterogeneous Chiplet Systems Up to 110 GHz." Proceedings of the 2025 Asia-Pacific Microwave Conference, APMC 2025, Jeju Island Institute of Electrical and Electronics Engineers Inc., 2025.

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