Different Debt: An Addition to the Technical Debt Dataset and a Demonstration Using Developer Personality
Graf-Vlachy L, Wagner S (2024)
Publication Type: Conference contribution
Publication year: 2024
Publisher: Association for Computing Machinery, Inc
Pages Range: 31-35
Conference Proceedings Title: Proceedings - 2024 ACM/IEEE International Conference on Technical Debt, TechDebt 2024
Event location: Lisbon, PRT
ISBN: 9798400705908
Abstract
Background: The “Technical Debt Dataset” (TDD) is a comprehensive dataset on technical debt (TD) in the main branches of more than 30 Java projects. However, some TD items produced by SonarQube are not included for many commits, for instance because the commits failed to compile. This has limited previous studies using the dataset. Aims and Method: In this paper, we provide an addition to the dataset that includes an analysis of 278,320 commits of all branches in a superset of 37 projects using Teamscale. We then demonstrate the utility of the dataset by exploring the relationship between developer personality by replicating a prior study. Results: The new dataset allows us to use a larger sample than prior work could, and we analyze the personality of 111 developers and 5,497 of their commits. The relationships we find between developer personality and the introduction and removal of TD differ from those found in prior work. Conclusions: We offer a dataset that may enable future studies into the topic of TD and we provide additional insights on how developer personality relates to TD.
Involved external institutions
Germany (DE)How to cite
APA:
Graf-Vlachy, L., & Wagner, S. (2024). Different Debt: An Addition to the Technical Debt Dataset and a Demonstration Using Developer Personality. In Proceedings - 2024 ACM/IEEE International Conference on Technical Debt, TechDebt 2024 (pp. 31-35). Lisbon, PRT: Association for Computing Machinery, Inc.
MLA:
Graf-Vlachy, Lorenz, and Stefan Wagner. "Different Debt: An Addition to the Technical Debt Dataset and a Demonstration Using Developer Personality." Proceedings of the 7th ACM/IEEE International Conference on Technical Debt, TechDebt 2024, co-located with the International Conference on Software Engineering, ICSE 2024, Lisbon, PRT Association for Computing Machinery, Inc, 2024. 31-35.
BibTeX: Download