Energy dissipation of metallic microlattices under extreme thermomechanical environments

Kang SG, Bellón B, Bhaskar LK, Zhang S, Ding K, Götz A, Wirth J, Apeleo Zubiri B, Kalácska S, Jain M, Sharma A, Koelmans WW, Schürch P, Spiecker E, Michler J, Schwiedrzik J, Dehm G, Ramachandramoorthy R (2026)


Publication Type: Journal article

Publication year: 2026

Journal

Book Volume: 310

Article Number: 122131

DOI: 10.1016/j.actamat.2026.122131

Abstract

Metallic micrometamaterials exhibit exceptional specific strength and energy dissipation capacity, yet their mechanical behavior under extreme thermomechanical conditions remains poorly understood. Here, we uncover deformation mechanisms in metallic microlattices subjected to combined thermal and mechanical extremes. Copper microlattices were fabricated via a localized electrodeposition process with submicron spatial resolution and, for the first time, compressed at cryogenic (-150 °C) and room temperatures under high strain rates up to 100 s-1. The copper microlattices, characterized by micron-sized grains and randomly oriented growth twins, exhibit distinct temperature- and strain rate-dependent deformation responses that lead to enhanced energy dissipation. Compression tests on copper micropillars, which are dimensionally equivalent to the microlattice struts, reveal substantial shifts in deformation mechanisms from dislocation slip to mechanical twinning as a function of temperature and strain rate. Together, these results provide a comprehensive framework for designing metallic micrometamaterials optimized for extreme thermomechanical environments.

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APA:

Kang, S.G., Bellón, B., Bhaskar, L.K., Zhang, S., Ding, K., Götz, A.,... Ramachandramoorthy, R. (2026). Energy dissipation of metallic microlattices under extreme thermomechanical environments. Acta Materialia, 310. https://doi.org/10.1016/j.actamat.2026.122131

MLA:

Kang, Sung Gyu, et al. "Energy dissipation of metallic microlattices under extreme thermomechanical environments." Acta Materialia 310 (2026).

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