Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras
Pandey A, Kuhn S, Erdogan H, Schneider K, Elger G (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
Event location: Cracow, POL
ISBN: 9781728160498
DOI: 10.1109/EuroSimE48426.2020.9152716
Abstract
This paper investigates the most common sources for Change in Sharpness (CIS) of an automotive camera system. Deformation related to mismatches in Coefficient of Thermal Expansion (CTE) and creep in the BGA-Solder interconnect has been identified as most important source of CIS. This paper focuses on the development of a Zero-Hour model for a later planned extensive thermal cycling simulation investigating CIS over system life time. The Model is based on a simplified camera module, simulated in the thermal operations window of the system. The Zero-Hour model includes the curing process of the adhesive, which accounts for residual deformation in the components during assembly. Using this as a baseline, temperature cycling was simulated to investigate creep in the solder interconnects.
Involved external institutions
Germany (DE)How to cite
APA:
Pandey, A., Kuhn, S., Erdogan, H., Schneider, K., & Elger, G. (2020). Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras. In 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Cracow, POL: Institute of Electrical and Electronics Engineers Inc..
MLA:
Pandey, Amit, et al. "Finite Element Analysis: A Tool for Investigation of Sharpness Changes in Automotive Cameras." Proceedings of the 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020, Cracow, POL Institute of Electrical and Electronics Engineers Inc., 2020.
BibTeX: Download