The Micro‐Nano Hybrid Filler Al 2 O 3 @ CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites

Lu Z, Wu W, Drummer D, Rösel U, Tomiak F, Wang Y, Liu C, Li S, Zhao X (2026)

Publication Type: Journal article

Publication year: 2026

Journal

Journal of Polymer Science Wiley-Blackwell

Article Number: pol.20251194

DOI: 10.1002/pol.20251194

Abstract

In this study, a micro/nano hybrid filler comprised of Al2O3@CuNPs is synthesized through a chemical reduction method. The incorporation of Cu nanoparticles serves as a bridge, addressing the contact issues within the filler and substantially enhancing its ability to establish a thermal conductivity network. The filler loading was kept at a constant level up to 70 wt%; however, the copper amount was varied between 0 and 10 wt%. The resulting thermal conductivity of the Al2O3@CuNPs/EP composite exhibits a gradual increase with the filler content, reaching 1.06 W/mK at a total filler content of 70 wt%. This represents a remarkable growth rate of 457.9% compared to pure EP. This material holds promising potential for applications in thermal conductivity materials.

Authors with CRIS profile

Dietmar Drummer Lehrstuhl für Kunststofftechnik (LKT) Uta Rösel Lehrstuhl für Kunststofftechnik (LKT) Florian Tomiak Lehrstuhl für Kunststofftechnik (LKT)

Involved external institutions

East China University of Science and Technology (ECUST) CN China (CN)

How to cite

APA:

Lu, Z., Wu, W., Drummer, D., Rösel, U., Tomiak, F., Wang, Y.,... Zhao, X. (2026). The Micro‐Nano Hybrid Filler Al 2 O 3 @ CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites. Journal of Polymer Science. https://doi.org/10.1002/pol.20251194

MLA:

Lu, Zijian, et al. "The Micro‐Nano Hybrid Filler Al 2 O 3 @ CuNPs Is Used to Improve the Thermal Conductivity of Epoxy Resin Composites." Journal of Polymer Science (2026).

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