Rauer M, Franke J (2019)
Publication Type: Authored book
Publication year: 2019
Publisher: Springer Berlin Heidelberg
ISBN: 9783662531204
Automatic X-ray inspection (AXI) is a nonde-structive test method for inline process monitoring and 100% quality control in electronic production (Neubauer 1997). Electronic components which are not visually accessible can be penetrated by X-rays to expose hidden features such as voids and cracks in the solder joints, as well as bridging, open solder joints, missing balls, and delamination (Maur 2005; IPC-7095C 2013). At the beginning of the X-ray inspection, the systems for solder joint inspections were not fully auto-mated. People were involved to classify the solder joints. Human inspection is relatively slow and expensive, and repeatability is poor; thus it is only used for offline inspection. Advanced X-ray systems are inline and combined with digital image-processing tools for automated defect clas-sification (Neubauer 1997). Besides the fully automatic inline inspection for 100% testing, a fully automatic offline inspection for smaller batch numbers or higher quality is possible, just like semiautomatic offline inspection for very small batch numbers (Berger 2012).
APA:
Rauer, M., & Franke, J. (2019). Automatic X-ray Inspection (AXI). Springer Berlin Heidelberg.
MLA:
Rauer, Miriam, and Jörg Franke. Automatic X-ray Inspection (AXI). Springer Berlin Heidelberg, 2019.
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